NVIDIA and Cisco introduce USFP optics for next-generation AI factories

NVIDIA and Cisco announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new optical-module form factor for next-generation AI-factory networks.

The first planned USFP transceivers will use an OSFP-sized footprint with 16 full-duplex lanes. They are designed to support up to 12.8 Tb/s of total capacity and connect 1.6-Tb/s endpoints without adding network tiers.

USFP is designed for 400 Gb/s electrical signals per lane. Compared with 200 Gb/s-per-lane modules, the companies say it provides four times the bandwidth density and approximately 1.3 times the power efficiency.

Connector and cooling design

USFP uses a two-dimensional array connector with a two-step insertion process. High-speed contacts engage after the module is inserted, which NVIDIA and Cisco say is intended to reduce contact wear, improve signal integrity and make insertion force more predictable.

The modules will support up to 100 watts of power dissipation without a separate embedded cooling circuit. The design can later scale to 32 full-duplex lanes and beyond.

USFP configurations will also support a range of optical technologies and connection distances. The companies say simplified signal processing can reduce latency and power consumption.

Supplier ecosystem

NVIDIA and Cisco are working with TE Connectivity and Amphenol on USFP cages, connectors and modules. Additional partners are expected to join.

The companies plan to develop an open industry specification through an upcoming community-led multi-source project. The work also builds on interoperability between NVIDIA Spectrum-X Ethernet networking and Cisco Silicon One-based systems.